欣銓科技提供晶圆级晶粒尺寸封装(Wafer Level Chip Scale Packaging)后段製程服务。包含晶片研磨/晶背贴胶/晶背打印/雷射预切/晶粒切割/自动光学检视/並將IC直接用机台放置於Carrier tape中。
Key Process Machine:
| Main Process Equipment | |||||
| No | Stage | Key Process Name | Brand | Model | |
| 1 |
BGD |
Wafer Backgrind |
Disco | DFG8560 | |
| Accretech | PG3000RM | ||||
| 2 | WLM | Wafer Laser mark | EO | CSM3000 | |
| 3 | LG | Laser Grooving | Disco | DFL 7161 | |
| 4 | DICING | Dicing Saw | Disco | DFD 6362 | |
| 5 | AOI | Auto Optical Inspection | Camtek | Condor | |
| 103 PD | |||||
| 6 | TnR | Die Sorter(Tape & Reel) | STI | Isort-Maxx | |
| Isort-Express | |||||
| Ueno | RS-20 | ||||